Ansys Q3D Extractor
Accurate RLCG parasitic extraction for high-speed electronic design.
Executive Summary
Ansys Q3D Extractor is a specialized 3D quasi-static electromagnetic (EM) simulation software designed for the accurate extraction of parasitic parameters in electronic designs. It performs detailed EM field simulations to calculate frequency-dependent resistance, inductance, capacitance, and conductance (RLCG) for complex interconnects, traces, and components. This capability is crucial for engineers to predict and mitigate issues related to signal integrity, power integrity, and electromagnetic compatibility (EMC) in high-frequency and high-speed electronic systems. Integrated within the Ansys Electronics Desktop (AEDT), Q3D Extractor works seamlessly with other Ansys simulation tools like Ansys HFSS, Ansys Maxwell, and Ansys SIwave, enabling comprehensive multiphysics analysis of entire electronic systems. It supports the design and optimization of various electronic structures, including IC packages, printed circuit boards (PCBs), and connectors, by providing critical parasitic data that influences overall system performance and reliability. The software is vital for engineers developing advanced electronics across various industries, ensuring designs meet stringent performance requirements. It handles complex geometries and material properties, offering robust simulation capabilities. Furthermore, Ansys Q3D Extractor can leverage high-performance computing (HPC) resources, including cloud-based solutions, to accelerate simulations and handle large, intricate designs efficiently.
Use Cases
- Signal Integrity Analysis: Accurately extract RLCG parameters for high-speed interconnects to predict and mitigate signal degradation, crosstalk, and reflections.
- Power Integrity Analysis: Analyze parasitic effects in power delivery networks (PDNs) to ensure stable voltage supply and minimize noise.
- Electromagnetic Compatibility (EMC) Analysis: Identify and reduce electromagnetic interference (EMI) issues by understanding parasitic coupling paths.
- Package and PCB Design Optimization: Extract parasitics from IC packages, printed circuit boards (PCBs), and connectors to optimize their electrical performance.
- Characterization of Passive Components: Model and characterize the frequency-dependent behavior of passive components like inductors, capacitors, and resistors.
Features
Visibility
- 3D Field Visualization: Visualize electric and magnetic fields, current densities, and charge distributions within the design.
Intelligence
- High-Performance Computing (HPC): Leverage multi-core processors and distributed computing for accelerated simulation of complex designs.
Technical Specifications
- Architecture
- Integrated within Ansys Electronics Desktop (AEDT) for comprehensive multiphysics simulation workflows.
- Deployment
- On-Premise, with optional Hybrid cloud HPC capabilities via Ansys Cloud.
- API Available
- Yes
Infrastructure
- AWS
Integrations
- Ansys HFSS
- Ansys Maxwell
- Ansys SIwave
- Ansys Icepak
- Synopsys OptoCompiler
- Cadence
- Siemens EDA
Security & Compliance
Certifications: SOC 2
Pricing
- Model
- Perpetual or Subscription Licensing
- Starting Price
- Contact sales
- Target Customer
- Mid-Market,Enterprise,Academic
- Contract Type
- Annual
- Free Trial
- Yes (no credit card required)
Ratings & Reviews
G2: 4.7/5/5
About Ansys
Ansys, Inc. is an American multinational company headquartered in Canonsburg, Pennsylvania, and a global leader in engineering simulation software. It develops and markets CAE/multiphysics engineering simulation and 3D design software, enabling innovators across various industries to accelerate product development and optimize performance. Ansys is in the process of being acquired by Synopsys, with the acquisition announced in January 2024.